Solder Flux ECOFREC 200 – Low Residue, Halogen-free

Solder flux ECOFREC 200 Low residue seen on PCB, no-clean air or nitrogen atmosphere.

​SPECIFICATIONS SOLDER FLUX ECOFREC 200

CHARACTERISTICS SOLDER FLUX ECOFREC 200

Physical state: Liquid

Colour: Colourless.

Odour: alcohol odour.

Odour threshold: Not available

Melting point : -89,5 °C

Freezing point: Not available

Boiling point: 82 °C

Flammability: Highly flammable liquid solder flux and vapour.

Explosive properties: Not explosive material according to EC criteria. Can form explosive mixtures with air.

Oxidising properties: Non-oxidizing material according to EC criteria.

Explosive limits: Not available

Lower explosion limit: 2 vol %

Upper explosion limit: 12 vol %

Flashpoint : 16 °C (closed cup)

Auto-ignition temperature: 425 °C

Decomposition temperature: Not available

pH: Not applicable

Viscosity, kinematic: Not available

Solubility: Soluble in other organic solvents.

Water: In water, the material is partially soluble

Partition coefficient n-octanol/water (Log Kow): Not available

Vapour pressure: 42 mbar (20°C)

Vapour pressure at 50 °C: Not available

Density : 0,8 g/cm³ (20°C)

Relative density: Not available

Relative vapour density at 20 °C: 2

Particle characteristics: Not applicable

– Electrical performances are exceptionally high after ageing in a humidity chamber, with a SIR value on inter-digit IPC B 24 comb close to 105  Megohms under storage conditions of 21 days at 40°C, 93 % RH, 5 Volts, or 7 days at 85°C, 85 % RH, 50 Volts (IPC TM 650 2.6.3.3 Rev A).

– Packing: Plastic drum 20 litres

– Solder flux ECOFRECTM 200 must be stored in a relaxed and well-ventilated area (between 5° and 30°C), in a securely closed packaging. Its maximum shelf life is a year. 

ECOFRECTM 200 must be stored at room temperature for 12 hours before use.

PROCESS PARAMETERS

Solder flux ECOFRECTM 200 can exclusively be applied by spraying, atomization under air or nitrogen pressure, or with ultrasounds.

APPLICATION SOLDER FLUX ECOFREC 200

Solder flux ECOFREC 200 is a no-clean, solder flux recommended for soldering either in an air or nitrogen-controlled atmosphere. Good solder joints without solder balling are achieved with this low residue flux. Solder flux ECOFRECTM 200 is compatible with a wide range of solder masks.

Spray process solder flux ECOFREC 200

SHOULD BUY SOLDER FLUX ECOFREC 200 AT THE-TECH?

Established in 2014, THE-TECH specializes in distributing materials, chemicals, and components for electronic manufacturing and assembly. The products distributed by THE-TECH always ensure high quality, and safety, and always comply with European safety regulations (RoHS), environmental regulatory standards, and other standards.

– THE-TECH brings the best service to customers, from consultation to delivery. Optimizing shipping costs at the lowest or free shipping. 

– Solder flux ECOFRECTM 200 is always available at the warehouse to quickly respond to customers’ requests in large quantities.

– Regarding the price, THE-TECH always has a suitable and very competitive price list for the ECOFRECTM 200 solder flux on the market, which customers can refer to.

To get solder flux ECOFRECTM 200 and the best products, materials, and components for production, come to THE-TECH. Genuine products and reasonable prices bring the best economic value to customers.

TH-ELECTRONIC TECHNOLOGY CO

Ad: 82 Street 13, Phuoc Binh Ward, Thu Duc City, Ho Chi Minh City

Tel: (+84.28).3728.1992

Fax: (+84.28).37281992

info@thetech.com.vn

www.thetech.com.vn

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