Lead Free Solder Paste P007-16T4 was created by INVENTEC's company. From the experience of INVENTEC firm, solder has no lead with alloy of 2 components tin & copper. Production application for companies or factories.
Company TH would like to introduce in detail the specifications of the product P007-16T4.
ECOREL FREE 007-16T4
No silver / low voiding Halogen free solder paste
ECORELTM FREE 007-16 T4 is part of our second generation of No Clean solder paste combining the metallurgical properties and cost benefits of SnCu – an eutectic leadfree alloy - with high performance chemistry of the ECORELTM range assuring a robust assembly process for high volume electronics. The fine particle size distribution of its type 4 powder enhances the printing quality for small apertures.
Very Low solder void percentage
Excellent visual solder joint cosmetics/ transparent residues even after multiple reflow cycles
High first pass yield testability in ICT
Very good wetting in different board finishes including OSP.
The radar chart below shows the excellent printing capabilities of ECORELTM FREE 007-16 which allows for high speed printing, excellent abandon time, and long, steady tackiness. Its large process window allows for good soldering of medium and large boards with a wide range of component sizes.
High performance in pin in paste process
PACKAGING & STORAGE
To ensure the best product performance, the recommended storage temperature range is from 0°C to 10°C. For an optimal preservation, store cartridges and syringes in vertical position, tip downwards.
Jars 250g or 500g 12 months.
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